Englisg Abstract
| Year(Vol.) No. Pages |
Title | Author(s) | Keywords |
|---|---|---|---|
| 2012(Vol.85) 1 p.3 - 9 | A Study on a New Testing Method by Dynamic Viscoelastic Properties for the Rubber Processing Analysis | Masakazu MANAKA Jiro KOGUSURI | Mixing process, Polymer-carbon black interaction, Carbon black dispersion, Rubber compound, Payne effect, Dynamic viscoelastic properties, Activation energy |
| 2012(Vol.85) 1 p.18 - 22 | Ultra Fine Particle Calcium Carbonate for Functional Additive | Shoichi TSUTSUI Tomoaki SUGITA | Ultra-fine preticipated calcium carbonate, Dispersibility, Tackiness, Precipitated silica, Carbon black |
| 2012(Vol.85) 1 p.10 - 17 | Haigoshi - Compounding Specialists (2) | Hitoshi YAMADA | Haigoshi, Compounding Specialist, Compounding, Compound Recipe, Compounding Agent, Accelerator, History, Industry, Mitatsuchi, Dunlop |
| 2012(Vol.85) 2 p.33 - 39 | Application of Polymers to Photoresist Materials | Akimasa SOYANO | Photolithography, Photoresist, i-line, KrF, ArF |
| 2012(Vol.85) 2 p.40 - 45 | Latest Technology of Stress Buffer Material for Semiconductor Application | Kohji Katoh | Polyimide, Polybenzoxazole, Stress Buffer, Cu Redistribution, Wafer Level Packaging, Adhesive |
| 2012(Vol.85) 2 p.46 - 51 | Material Design and Evaluation Technology of Backgrind Tape | Taro INADA Masashi KUME | Backgrind, Acrylate, Semiconductor, Wafer, Surface, Protection |
| 2012(Vol.85) 2 p.52 - 57 | Requirements and Development Trend of Dicing Tapes | Kazuhiro TAKAHASHI | Semiconductor, Wafer, Dicing, Adhesive, Tape |
| 2012(Vol.85) 2 p.58 - 63 | Material Design of the Die-bonding Film Based on Polyimide/Epoxy Resin | Takashi MASUKO | Die-Bonding Film, Stacked-CSP, Polyimide, Dynamic Mechanical Properties, Stress Relaxation, Adhesion Strength |
| 2012(Vol.85) 3 p.75 - 80 | Functional Group Analysis of the Surface and Cut Surface NBR after Peroxide Cured | Jing Sang Hidetoshi HIRAHARA Katsuhito MORI Yusuke MATSUNO Takahiro KUDO Sumio AISAWA Eiichi NARITA Yoshiyuki OISHI Kunio MORI | NBR, Surface, Functional Structure, Curing process, XPS, DCP, Oxide functional groups, Contact angle |
| 2012(Vol.85) 3 p.81 - 86 | Evaluation of Resistance of Fluoroelastomer to Ozone in Water | Satoshi MIWA Yoshito OHTAKE Keiji TANAKA | Ozone, Water, Fluoroelastomer, Cross-linking, Force-distance Curve, Fourier-transform Infrared Spectroscopy |
| 2012(Vol.85) 3 p.87 - 92 | Study on Cis-trans Isomerization in Diene Rubbers during Vulcanization | Koya YOSHIMOTO Masayoshi ITO | Cis-trans Isomerization, Vulcanization, ESR, Solid-state 13C-NMR, BR, Sulfur, Zinc Oxide |
| 2012(Vol.85) 3 p.93 - 100 | Blend and Composite Materials based on Solid Polymer Electrolytes | Yoichi TOMINAGA | Solid polymer electrolyte, Ionic conductivity, Lithium-ion battery, Polymer blend, Composite, Mesoporous silica, Clay |
| 2012(Vol.85) 3 p.101 - 106 | Stretchable Electronics | Tsuyoshi SEKITANI Takao SOMEYA | organic transistors, elastic conductors, stretchable electronics, flexible electronics |
| 2012(Vol.85) 3 p.107 - 114 | Odyssey of Hevea tree around the World: From Wickham to Ford | Shinzo KOHJIYA | |
| 2012(Vol.85) 4 p.117 - 122 | Present and Future of Seismic Protection System | Toshio NISHI | Seismic-protection Elastomeric Isolator, East Japan Giant Earthquake, Durability, Seismic-control system |
| 2012(Vol.85) 4 p.123 - 130 | Development of the International Standard (ISO) and Japanese Industrial Standard (JIS) for Elastomeric Seismic-Protection Isolators | Toshikazu YOSHIZAWA | Rubber bearing, Earthquake, Seismic Isolation, International Standard (ISO), Japanese Industrial Standard (JIS) |
| 2012(Vol.85) 4 p.131 - 137 | Elastomeric Seismic-protection Isolators for Bridges | Eiji KOBAYASHI Kazuhiro KANEKO | Bridge, Rubber, Bearing, Elastomeric seismic-protection isolator, Earthquake |
| 2012(Vol.85) 4 p.138 - 145 | The Property of Buildings with Seismic Isolation Systems in the 2011 Tohoku Offshore the Pacific Coast Earthquake | Nobuyuki OGINO Yoshihisa KITAMURA Nagahide KANI | Seismic-Isolation, Earthquakes, Expansion Joints, Steel-Dampers, Lead-Dampers, Lead Rubber Bearings |
| 2012(Vol.85) 4 p.146 - 149 | Seismic Isolation Technology -Its Process of Spread and Future | Keiichi NISHIO | Seismic Isolation Technology, East Japan Giant Earthquake |