English Abstract

Build-up Material for IC Package Substrates

Genjin MAGO
Ajinomoto Fine-Techno Co., Inc. Kawasaki-ku, Kawasaki City, Kanagawa, Japan
Nippon Gomu Kyokaishi,(2011),84(10),321-325 General Review in Japanese

The build-up substrates are generally used for IC package. As the integration of semiconductor has increased, higher performance of insulation material is required for build-up substrates. In this article, the author explains the characteristics of build-up material required for IC package and latest technology trends for next generation.

Keywords: Build-up Material, IC Package Substrate, Epoxy Resin, Insulation Material