English Abstract

Material Dependence in Direct Adhesion of Halogen-containing Rubber to Resins During Curing Using Molecular Adhesives

Hidetoshi HIRAHARA
Katsuhito MORI
Takahiro KUDO
Yoshiyuki OISHI
Kunio MORI
Graduate School of Engineering, Iwate University, Morioka, Japan
Nippon Gomu Kyokaishi,(2010),83(12),383-389 Original Paper in Japanese

Various resins (adherends) were treated with a corona discharge apparatus to give OH groups on the surfaces.
The reaction of obtained OH group-linked resins and 6-triethoxysilylpropylamino-1,3,5-triazine-2,4-ditiol (TES) produced TES-linked resins. Direct adhesions of halogen-containing rubbers (adhesives) to TES-linked resins during curing were investigated for the material dependence on adherends and adhesives, and reacting points and their concentration in the adhesives. Other than direct adhesion of halogen-containing rubbers with high reactive curing agents and low concentration of reactive points and TES linked resins, the adhesion products of various resins and halogencontaining rubbers indicated high peel strength and 100% rubber coverage. The results indicate that rubber materials are independent on resin materials in the direct adhesion. In the direct adhesion of halogen-containing rubbers to various TES-linked resins during curing, resin types had no sufficient effect on peel strength and rubber coverage expected for PP. The direct adhesion of PP and halogen-containing rubbers gave low peel strength and rubber coverage because PP is given with low OH group concentration by corona discharge treatment. When chemical bond concentration at interfacial layer is constant, peel strength decreased with an increase in network chain concentration.
The phenomenon is explained by the stress dispersion, which relates to the elastic modulus of valucanizates.

Keywords: Direct Adhesion, 6-triethoxysilylpropylamino-1,3,5-triazine-2,4-ditiol (TES), Halogen-containing Rubbers, Corona Discharge, Chemical Bond