English Abstract

Direct Adhesion of EPDM to Aluminum Plate During Peroxide Curing Using Molecular Adhesives

Takahiro KUDO
Hidetoshi HIRAHARA
Yoshiyuki OISHI
Kunio MORI
Iwate University,Graduate School of Engineering, Morioka, Japan
Nippon Gomu Kyokaishi,(2010),83(4),89-94 Original Paper in Japanese
The direct adhesion of EPDM compound to Al plate during peroxide curing on the bases of the molecular adhesive method has been investigated. The treatment of Al plate with the ethanol solution of molecular adhesives, 6-(3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-dithiol (TES) gave the TES-linked Al plates by the following three processes such as a immersion process of Al plate in the solution, an adsorption process of TES to OH groups on Al plate, and a linking process between TES and Al plate. The direct adhesion of EPDM compound to Al plate by these processes indicated a significant effect on the peel strength, because they induce the formation of interfacial bond between EPDM compound and TES-linked Al plate. Ingredients in EPDM compound had also an important influence on the formation of interfacial bond, it means thiol groups on the linked-TES did not react directly with EPDM molecular chains in the presence of dicumyl peroxide (DCP). In the EPDM compounds, ingredients such as DCP and m-phenylene bismaleimide (m-BMI) were essential for the direct adhesion of EPDM to TES-linked Al plate. The Al/EPDM adherends obtained had good heat resistance at 120 but decreased the peel strength with aging time at 95 in water. The poor water resistance is estimated to be dependant for the corrosion of Al plate.
Keywords: 6-(3-triethoxysilylpropyl) amino-1,3,5-triazine-2,4-dithiol (TES), TES-linked Al plate, TES-treating conditions, EPDM compound, Heat and water resistance