English Abstract

High Thermal Conductive Insulating Epoxy Resins Yoshitaka TAKEZAWA Hitachi Research Laboratory, Hitachi, Ltd., Hitachi-shi, Ibaraki-ken, JAPAN Nippon Gomu Kyokaishi,(2008),81(3),99-104 General Review in Japanese Abstract Present electrical devices have large calorific power, then improvement of heat dissipation has been a very important subject. We developed the novel epoxy resins which increased the thermal conductivity that has been a barrier to heat dissipation. The medium of thermal conduction for insulating resins is phonons. Phonon conduction depends on the crystallinity, since it is a lattice vibration. The scattering of phonons happens at the interface of an amorphous structure. If there is a macroscopic amorphous structure despite the existence of crystal structure on the microscopic level, we expected that high thermal conduction could be attained by reduced scattering of phonons through controlling the nano scale structure. Using an epoxy resin which has the mesogen structure would solve this problem because it's easy to carry out an orientation with this structure. As a result, we confirmed that thermal conductivities become higher when the amounts of mesogens were increased. The conductivity of the developed epoxy resin was about five times higher than that of the conventional epoxy resin. Keywords: Epoxy Resin, Thermal Conductivity, Phonon, Insulation

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