English Abstract

Direct Adhesion of Silicone Rubber to Resins During Peroxide Curing Using Molecular Adhesive Kazuhisa TAKAGI Hidetoshi HIRAHARA Katsuhito MORI Eiichi NARITA Yoshiyuki OISHI Kunio MORI Iwate University, Faculty of Engineering, Department of Chemical Engineering, Ueda, Morioka, Japan Nippon Gomu Kyokaishi,(2008),81(1),8-13 Original Paper in Japanese Abstract A new concept has been proposed for adhesion theory and technology, unifying various adhesion theories and simplifying adhesion technology. Furthermore, thermal diffusivity of thin films of 200ƒÊm thickness taken out from NR sheet were measured by temperature wave analysis. This purpose is achieved by using a molecular adhesive, 6-(3-triethoxysilylpropylamino)-1,3,5-triazine-2,4-dithiol (TES), which contains two functional groups of dithiol triazinyl and alkoxysilyl groups in one molecule. Resins such as epoxy resin, polyamide, and polyester were pretreated by corona discharge to form OH groups on the surfaces. The OH groups react readily with TES by heating for 10 min at 150 to give TES containing resin surfaces. Silicone rubber adhered readily to the TES containing resin surfaces by hot-pressing for 10 min at 160 , with very high peel strength which is destroyed in rubber-phase. Peel strength decreased with surface roughness on resins, and the amount of TES decreased with the roughness. (Received on June 6, 2007) (Accepted on November 13, 2007) Keywords: Unifying Adhesion Theories, Simplifying Adhesion Technology, Molecular Adhesive TES, Resins, Silicone Rubber, Peroxide

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