English Abstract

Soft-Materials for Electronic Components Kazunori YAMAMOTO High performance materials R&D Center, Hitachi Chemical Co., Ltd., Ibaraki Nippon Gomu Kyokaishi,(2006),79(1),35-41 General Review in Japanese Abstract The electronic parts and devices are improved in their performance year by year, because the miniaturization of the electronic phones, digital cameras etc. recently. Many kinds of soft-materials are used in electronic materials such as laminates, die-bonding materials, epoxy molding compounds, etc., which are very important in stacked CSPs. In this paper, the features of the electronic materials based on soft-materials and manufacturing processes of stacked CSPs are described. Keywords: Electronic parts, Electronic devices, Soft-material, Laminates, Die-bonding materials, Epoxy molding compounds

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