English Abstract

Fluid Molecular Bonding of the Aluminum Plates and EPDM

Masashi NEMOTO *1
Hisashi AKAIKE *2
Kazuhisa TAKAGI *3
Hidetoshi HIRAHARA *1
Kunio MORI *4
*1:Graduate School of Engineering, Iwate University, Morioka, Japan
*2:ASAHI RUBBER INC., Nishi-shirakawa, Fukushima, Japan
*3:ASAHI FR Laboratory INC., Shirakawa, Fukushima, Japan
*4:Sulfur Chemical Laboratory Inc., Morioka. Iwate, Japan
Nippon Gomu Kyokaishi,(2016),89(11),323-329 Original Paper in Japanese

The molecular bonding of EPDM compounds to 3-Acryloxy propyl trimethoxy silane(ACP) adsorbed Al plates has been investigated during crosslinking. The ACP adsorbed Al plates were obtained after immersing the Al plates to the ethanol solution of the ACP, by drying in dry air. The adsorbed weight was determined the ACP adsorption concentration of Al plates by weight measurement method and FT-IR method. The both linear relationship is obtained. Each value was determined from a calibration curve for adsorption. Peel strength at 0.1 wt% for the ACP concentration shows the weakest value and does interfacial failure. At the ACP concentration more than 0.5 wt%, cohesive peeling failure was observed to destruct in rubber phase. At the crosslinking temperature at 140 , Al/EPDM bonding materials show large elongation, network chain concentration of EPDM is estimated to be extremely low. Peel strength at 155 for crosslinking temperature was about 2-times higher than at 170 . Further, failure occurred in crosslinked Al/ EPDM bonding materials. The interfacial bonds between Al and EPDM compounds during crosslinking were formed. The molecular bonding mechanism was finally discussed.

Keywords: 3-Acryloxypropyltrimethoxysilane (ACP), ACP Adsorbed Al Plates, Reacts, EPDM, Molecular Adhesive, Molecular Bonding