English Abstract

Eco-Conscious Adhesion -Technological Aspects of Dismantlable Adhesives- Chiaki SATO Precision and Intelligence Laboratory, Tokyo Institute of Technology, Midori-ku,Yokohama, Japan Nippon Gomu Kyokaishi,(2008),81(9),364-369 General Review in Japanese Abstract Current technical trends on dismantlable adhesion are summarized in the article. The adhesives are useful for the adherend material recycling because their joints can be separated after use. Many dismantlable adhesives having novel dismantlement factors have recently been developed. An adhesive including thermally expansive fillers is the most typical one. An electrically separating adhesive and thermally melting adhesives, for instance, are also devel-oped and become widely used in these days. Another adhesive, which we developed, can resist high temperature and has high strength by the combination of changing thermally expansive fillers and resin modification that is suitable for dismantlable adhesives. It seems that new generation of dismantlable adhesives, for which electrochemical phenome-na and surface physics are utilized, will be realized in the future. Keywords: Adhesion, Dismantlable Joints, Expansion Agents, Micro Capsules, Adherend Recycling, Heat Resis-tance

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